Stencil Wiper Roll

Stencil Wiping Rolls are used to remove residual solder paste from the bottom side of PC Board stencils. Using Stencil Wiping Rolls prevents smearing, bridging, and solder balls caused by normal printing of solder paste onto PC Boards.

Sharp Screen printing on printed circuit boards (PCBs) requires clean stencils, Poly Cellulose and Poly Rayon fabric is specially engineered for under screen cleaning rolls, combining absorbency, strength, and low-limiting characteristics. The fabric quickly removes excess paste and adhesives from stencils – build-up that can ruin PCBs. That helps you produce better boards and faster.

 

Non-woven 100% Polyester Papers

Poly Rayon Stencil Roll is anti static and an especially effective wiping fabric used in PREMIUM grade stencil wiping rolls. It is tough, abrasion resistant, absorbent, and virtually free of particle generation. It is comprised of a synergistic blend of virgin polyester and rayon that is bonded into a uniform, super-tough fabric. These unique features give it a high degree of absorbency and effectiveness during the process of wiping stencils. Unlike no other, it is especially effective in cleaning lead-free solder paste because it has an aggressive cleaning surface and many cavities that can handle the extra “stickiness” of lead-free paste. This product is also effective when used dry, of course cleaning is always enhanced when wet.

Non-woven Polyester & Cellulose Papers

Poly cellulose stencil roll is an especially effective wipe. It is tough, abrasion resistant, absorbent, and virtually free of particle generation. It is comprised of a synergistic blend of virgin polyester and cellulose that is hydro-entangled into a uniform, super-tough fabric. These unique features give Polly cellulose stencil roll a high degree of absorbency and effectiveness during the process of general wiping.

Rewinding of fabrics

Selected raw material is then rewound over a standard PVC tube with or without notch. The fabric is wounded with specified meters of length and tension with a tension controller and a braking system and the end is been cut with a fine knife edge to prevent fabric hair lint’s.

Size and Specifications

40 to 60 GSM wiper papers are widely used in all SMT machines.

Suitable size for your machines.

MACHINE

PAPER SPECIFICATION

CORE

DEK

515

530

DEK

400

530

DEK

300

530

SAMSUNG/EKRA/KME

300

325

Characteristics

1. Low lint, ultra-low particle generation
2. Tear resistant, very strong and durable
3. With favorable performance of absorbing water and oil.
4. Cut automatically and folded in clean room
5. Solvent resistant
6. Super soft and cannot Scratch